BTU International Pioneers Fluxless Soldering with Advanced Formic Acid Reflow Technology for Semiconductor Packaging
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September 17, 2026
WESTFORD, Mass. — In a significant development for the microelectronics and semiconductor manufacturing sectors, BTU International has officially introduced a state-of-the-art Formic Acid Reflow capability. Engineered specifically to address the rigorous…
Bridging the Gap: How Artificial Intelligence is Moving from the Sandbox to the Packaging Plant Floor
September 15, 2026
By Rachael Pasini Editor-in-Chief, Design World Main Facts Artificial intelligence (AI) is no longer confined to theoretical whitepapers, proof-of-concept sandboxes, or isolated corporate pilot projects within the packaging sector. According to two…
