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Manufacturing Processes

BTU International Launches Aurora Vacuum Reflow Oven to Revolutionize Solder Void Reduction and High-Volume Electronics Assembly

Neng Nana By Neng Nana
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September 14, 2026
6 Min Read

WESTFORD, Mass. — In an era where electronics are becoming increasingly dense, powerful, and thermally demanding, manufacturing defects like solder voids present a critical challenge to long-term reliability. Addressing this industry-wide hurdle head-on,…